The fourth edition is suitable for professionals with practical experience in electroplating and also for beginners. It provides a clear, complete and up-to-date explanation for the principle and application of closely related electroplating technology. It not only replaces the third edition as a very effective information source for electroplating technology, but also pays attention to the electronic industry, from physical methods to electrochemical methods, especially the second generation product technology, such as copper interconnection technology.
The contents include: electroplating of various metals and alloys, electroplating of semiconductors and insulators, electrodeposition of conductive polymers, electroless plating of various metals and alloys, pretreatment process before plating, production process, monitoring, testing and control, electroplating and environment. It has been a quarter of a century since the third edition of Modern Electroplating was published. Electrochemical deposition has developed into a mature discipline with many new and potential applications. In order to describe these developments, the fourth edition of Modern Electroplating invited experts from Canada, the United States, Japan, Germany and other places (completely different from the author of the third edition) to present a complete monograph on electroplating for readers. The new edition covers a wide range of marginal topics, from semiconductor electroplating to environmental research.
The fourth edition is suitable for professionals with practical experience in electroplating and also for beginners. It provides a clear, complete and up-to-date explanation for the principle and application of closely related electroplating technology. It not only replaces the third edition as a very effective information source for electroplating technology, but also pays attention to the electronic industry, from physical methods to electrochemical methods, especially the second generation product technology, such as copper interconnection technology.
The contents include:
Electroplating of various metals and alloys
Electroplating of semiconductors and insulators.
Electrodeposition of conductive polymers
Electroless plating of various metals and alloys
Pretreatment process before electroplating
Production technology, monitoring, testing and control
Electroplating and Environment 1 Chapter Basic Principles
Part a electroplating electrochemistry
1. 1 electrode potential
Kinetic characteristics and mechanism of 1.2 electrodeposition
1.2. 1 current-voltage relationship
1.2.2 Effect of mass transfer on electrode dynamics
1.2.3 Faraday's law
1.2.4 current efficiency
1.2.5 coating thickness
1.2.6 atomic view of electrodeposition
1.2.7 pulse electroplating technology
The growth mechanism of 1.3
1.3. 1 Function of additives
1.3.2 Effect of additives on nucleation and growth
1.3.3 Leveling
1.3.4 brightness
1.3.5 additive consumption
1.4 Electroless plating and displacement plating
1.4. 1 electroless plating
1.4.2 displacement electroplating
Part b electroplating physics
Electroplating of 1.5 alloy
1.5. 1 overview
1.5.2 standard
1.5.3 deposit
Structure and properties of 1.6 coating
1.6. 1 overview
1.6.2 matrix and atmosphere
1.6.3 performance
1.6.4 impurities
1.7 Laminated coating and composite coating
1.7. 1 Overview
1.7.2 nanostructure electroplating
1.7.3 coating analysis
1.7.4 conclusion
Interdiffusion between 1.8 coatings
1.8. 1 overview
1.8.2 coating diffusion
1.8.3 pore formation
1.8.4 diffusion barrier
1.8.5 diffusion welding
1.8.6 electromigration
Part c electroplating materials science
1.9 structure
Structural analysis of 1.9. 1
1.9.2 Classification of coating materials
1. 10 hardness
The adhesive strength is 1. 1 1
Mechanical properties of 1. 12
1. 13 magnetism
1. 14 internal stress
refer to
Chapter 2 Copper Plating
Part a acidic copper plating
2. 1 history and development
2.2 Application
2.3 principle
2.4 Functions of each component of the solution
2.4. 1 copper and sulfuric acid
chloridate
fluoborate
2.5 additives
2.6 Operating conditions
Temperature +0
2.6.2 Current density and stirring
Ultrasonic stirring
2.6.4 Other mixed forms
Filtration and purification
equipment
positive electrode
specifications
2.7 Influence of impurities in acidic copper plating solution
2.8 Analysis method
2.9 nature and structure
2. 10 current modulation technology
2. 1 1 Electroplating on steel, zinc, plastic and aluminum
2. 12 PCB electroplating
2. 13 lattice electrodeposition of microelectronics
2. 14 electroforming
2. 15 high-speed electroplating
2. 16 diamond turning
2. 17 others
2. 17. 1 magnetism
2. 17.2 stripes
2. 17.3 Underpotential Deposition
refer to
B partial cyanide copper plating
2. 18 development history
2. 19 application
2.20 Main components of the solution
cupric cyanide
free cyanide
Sodium hydroxide or potassium hydroxide
2.2 1 Comparison of the Composition of Sodium Salt and Potassium Salt
2.2 1. 1 carbonate
2.2 1.2 tartrate
2.22 additives
2.23 Flash plating solution and Rochelle solution
2.24 operating conditions and solution characteristics
2.25 Maintenance of solution
2.26 Efficient Cyanide Copper Plating Solution
2.27 operating conditions and solution characteristics
2.28 solution maintenance
2.29 anode
2.30 Materials used
2.3 1 operating environment
2.32 structure and performance
refer to
C partial alkaline cyanide-free copper plating
refer to
Part d is copper plated with pyrophosphate.
2.33 Development history
2.34 Application
2.35 Basic components
2.36 composition
Copper and pyrophosphate
nitrate
ammonia
orthophosphate
additive
Operating conditions
Pyrophosphate/copper ratio
pH value
temperature
2.36. 10 current density
Stirring
2.36. 12 equipment
2.36. 13 anode
2.37 Maintenance
0 analysis
Impurities and purification
2.38 structure and performance
2.39 electroplating printed circuit board
refer to
Composite copper plating for electronic parts
2.40 alumina
2.4 1 performance
2.42 mechanism
2.43 continuous fiber reinforced composite metal
refer to
Chapter 3 Nickel Plating
Chapter 4 Electroplating Gold
Chapter V Electroless Silver Plating and Electroplating
Chapter 6 Tin and Tin Alloys for Lead-free Solders
Chapter VII Chromium Plating
Chapter VIII Electroplating of Lead and Lead Alloy
Chapter IX Tin-lead Alloy Electroplating
10 chapter zinc and zinc alloy electroplating
Electroplating of iron and ferroalloy in chapter 1 1
Chapter 12 electrodeposition of palladium and its alloys
13 chapter nickel alloy, cobalt and cobalt alloy electroplating.
Chapter 14 Electrodeposition of Semiconductors
Chapter 15 Electrodeposition on Insulator Surface
Chapter 16 organic film electroplating: conductive polymer
Chapter 17 Electroless Copper Plating
18 chapter electroless nickel plating
Chapter 19 Electroless Plating of Cobalt Alloy Films
Chapter 20 Electroless Plating of Pd and Pt
Chapter 265438 +0 Chemical Gold Plating
Chapter 22 Electroless Plating of Alloy
Chapter 23 Pretreatment before Electroplating
Chapter XXIV Production Technology
Chapter 25 Monitoring and Control
Chapter 26 Electroplating Environmental Load and Countermeasures
appendix