1. The curve temperatures set by BGA rework tables of different manufacturers are different. General lead-free material welding, the upper limit temperature is 245, the lower limit temperature is 260, and the infrared temperature 120 degrees.

2. I/O terminals of 2.BGA (ball grid array package) are distributed under the package in the form of circular or columnar solder joints. The advantage of BGA technology is that although the number of I/O pins has increased, the pin spacing has not decreased, thus improving the assembly yield. Although the power consumption is increased, BGA can be welded by controlled chipping method to improve its electrothermal performance. Compared with the previous packaging technology, the thickness and weight are reduced; The parasitic parameters are reduced, the signal transmission delay is small, and the use frequency is greatly improved; * * * It can be assembled by surface welding with high reliability.