order
Introduction to Chapter 1
1. 1 system chip is the inevitable development of microelectronics technology.
1.2 electronic design automation technology and hardware description language
1.2. 1 Overview of the development of electronic design automation technology
1.2.2 top. Down design method
1.2.3 hardware description language
Chapter 2 CMOS digital integrated circuits
2. 1 Introduction
2.2 Main production processes of integrated circuits
Wafer preparation
2.2.2 plate making
lithography
oxidate
deposition
corrode
spread
Conductor and resistance
2.3CMOS inverter and its layout
2.3. 1 MOS transistor and its layout
2.3.2CMOS inverter structure and its
field
2.4 Design Rules and Process Parameters
2.4. 1 Contents and functions of design rules
Geometric rules
Electrical rules
Characteristics of 2.5CMOS digital circuits
2.5. 1 standard logic level
Logical fan-out characteristic
2.5.3 Capacitive load and its influence
2.5.4 noise tolerance of CMOS circuits
2.6CMOS logic gate
2.6. 1 CMOS nor gate
2.6.2CMOS NAND gate
2.6.3 Multi-input CMOS logic gates
2.7NMOS transmission transistor and CMOS transmission gate
2.7. 1 NMOS transfer transistor
2.7.2CMOS transmission gate
utilize
Chapter 3 Hardware Description Language VHDL
3. 1 Introduction
3.2 Basic knowledge of VHDL
3.2. 1 VHDL program structure
HDL ... packages in the public repository
3.2.3 Lexical unit of VHDL
Data objects and types
Expressions and operators
3.3 VHDL structure description
3.3. 1 Description of structural behavior
RTL description of structure
Structural description of structure
3.4 substructure form of the structure
3.4. 1 process
3.4.2 Multi-process organization method of complex structure
3.4.3 yuan
subroutine
3.5 Sequential statements and concurrent statements
3.5. 1 sequential statements
3.5.2 Concurrent statement
3.6 signal and signal processing in VHDL
3.6. 1 signal drive source
Signal delay
3.6.3 Analog period and 8-delay of signal
Attribute function of signal
3.6.5 Signals with attribute function
3.7 other statements of VHDL
3.7. 1 Attribute Description and Definition Declaration
3. 7. 2 Asset statement
text
3.8 multivalued logic
3.8. 1 three-state numerical model
Multi-valued logic
3.9 Component instantiation
3.9. 1 Design common components
Construction package
Call of component
3. 10 configuration
3. 10. 1 default configuration
3. 10.2 Configuration of components
3. Configuration of10.3 block
3. Configuration of10.4 structure
utilize
The fourth chapter is the design of basic digital logic unit.
4. 1 combinational logic circuit design
4. 1. 1f] circuit
4. 1.2 tri-state buffer and bus buffer
4. 1.3 encoder, decoder and selector
4. Design of1.4 arithmetic unit
4. 1.5 ALU
4.2 sequential logic circuit design
4.2. 1 trigger
latch
register
4.2.4 Counter
4.3 memory
4.3. 1 Overview
Read-Only Memory
Random access memory
4.3.4 First in and then out of the stack
4.4 finite state machine
utilize
The fifth chapter is the hierarchical structure design of digital system.
5. 1 hardware algorithm model
5. Algorithm model of1.1FIFO stack.
5. 1.2 Algorithm of Booth One-bit Complement Multiplier
model
5.2 Division of Chip System
5.2. 1 parallel interface 8255
5.2.2 Structure of Booth's two's complement multiplier
design
5.3 Representation of Interconnection between Systems
5.4 System Simulation and Testing
5.4. 1 Overview
5.4.2 Simulation program design method
5. 4. 3 exlo establishes test procedures.
utilize
Chapter 6 SOC architecture
6. Structure of1SOC
6. 1. 1 Introduction
6. Hardware structure of1.2 SOC
6. 1.3 embedded software
6.2 embedded reduced instruction set processor in SOC
6.2. 1 Overview
Definition and characteristics of RISC
6.2.3 Instruction characteristics of RISC
6. 2. 4 RISC parallel processing technology
6.2.5 RISC/DSF structure
6. 2. 6 RISC kernel design
6.3 Architecture of Embedded Processor ARM
6.3. 1 Overview
ARM7 series processors
ARM9 series processors
6.3.4ARM9E series processors
6.3.5ARMl0 series processors
ARMll series processors
6.4 architecture of embedded processor MIPS324Kc
6.4. 1 Overview
6. 4. 2 IPS 324 KC embedded processor
6.5 interconnection mechanism of SOC
6.5. 1 Overview
6. 5. 2 MBA bus
Core connection bus
Bus and coach
6. 5. 5 CP bus
Virtual component interface
6.6 Embedded System Chip with ARM Core
for instance
6.6. 1LPC 2 100 series high-performance microcontroller
6.6.2a1191sam7x series high-performance microcontroller.
6.6.3AT9 1RM9200 High Performance Microcontroller
6.7 Embedded Real-time Operating System
6.7. 1 real-time operating system
6.7.2 Overview of Embedded Real-time Operating System
6.7.3 Real-time Multi-task Scheduling
Signal and semaphore
utilize
Chapter 7 Programmable Logic Devices
7. 1 overview
7. 1. 1 Development of Programmable Logic Devices
7. 1.2 user reconfigures circuit and programmable ASIC.
circuit
7. 1.3 classification of programmable logic devices
7.2 Programming elements of programmable logic devices
7.2. 1 fuse switch
Anti-fuse switch
7.2.3 floating gate programming technology
7.3 Circuit structure of PAL and GAL equipment
7.3. 1 PLD circuit representation method
7.3.2 Basic circuit structure of PLD
7.3.3 Circuit structure of PAL equipment
7.3.4 generic array logic GAL
7.4ispLSI series CPLD
7.4. 1 Overview
7.4.2 Structural Features of ISP LSI1000 Series CPLD
7.4.3 Test and programming characteristics of ISP LSI CPLD
7. 4. 4 ISP LSI 2000 series CPLD structure
IspLSI3000 series CPLD
7.4.6 The structure of ISP LSI 5000 V series CPLD and
principle of operation
7.4.7 Structure of ISP LSL8000/V Series CPLD
And working principle.
7.5 Field Programmable Gate Array
7.5. 1 Overview
7.5.2 structure and construction of xc4000 series FPGA
principle of operation
7. 5. 3 partial series FPGA
7.6 System Design and Implementation Based on High Density Programmable Logic Device
Overview of design and implementation
Selection of equipment
7.6.3 Design Process of HD PLD
utilize
Chapter 8 Programmable System Chip
8. 1 Overview of Programmable System Chip
8.2 virtex-Ⅱ series FPGA structure and
perform
8.2. 1 Overview
8.2.2 Overview of Virtex-II series FPGA
structure
8.2.3 Configurability of Virtex-II series FPGA
logical module
8. 2. 4 18 kilobit optional RAM module
Embedded multiplier
8.2.6 Global clock multiplexing buffer
8.2.7 Digital Clock Manager
Input and output module
8.2.9 Active Interconnection Technology
8.3 embedded RISC processor soft core MicroBlaze
8.3. 1 embedded micro-Blaze human-computer processor soft core
general situation
8.3.2 MicroBlaze of embedded processor soft core
structure
8.3.3 MicroBlaze of embedded processor soft core
Interface signal
8.4 virtex-ii pro series programmable system on chip
chip
8.4. 1 virtex-ii pro SOPC series overview
8.4.2 Embedded PowerPc405 processor core
8.4.3 Speed bidirectional serial transmitter
utilize
Chapter 9 ASIC design
9. 1 Introduction
9.2 Design of Gate Array and Gate Array
9.2. 1 gate array design
Entrance array
9.2.3 Gate Array and Design Process of Gate Array
9.3 Standard Unit Design
9.4 Design check
9.4. 1 Design Rule Inspection
Inspection of electrical rules
9.4.3 consistency check between layout and circuit diagram
Simulation after 9.5
utilize
Chapter 10 testable structural design
10. 1 LSI testable design
meaning
10.2 testability basis
10.2. 1 failure mode
10.2.2 testability analysis
10.2.3 test vector generation
LO.2.4 fault simulation
Testability structure design of 10.3 integrated circuit
1 special test design
10.3.2 scan test design
10.3.3 Built-in self-checking technology
10.3.4 system-level testing technology-boundary scanning
Testing technology
utilize
appendix
Appendix AVHDL standard package collection file
Appendix BIP core list
refer to