diffusion technique
The components on the chip are carefully manufactured by diffusion process. This process can remove impurities in the material, thus improving the purity of the material and making the performance of the chip more stable.
Aluminum wire connection
The circuit that connects the components closely together is made of aluminum wire. This material has good conductivity and plasticity, which can meet the requirements of high-density wiring of chips.
Heat-resistant effect
The thermal resistance of the chip is closely related to the material, manufacturing process and heat dissipation capacity of its silicon semiconductor. Generally speaking, the extreme temperature of the earth's core can reach an astonishing 168 degrees!
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Common packaging materials are ceramics and engineering plastics, which provide necessary protection for chips. Different packaging materials have different characteristics and can be selected according to the specific needs of the chip.
Scientific and technological miracle
The manufacturing process of the chip embodies the wisdom and sweat of countless researchers. The power of science and technology is everywhere, and every detail is the embodiment of great scientific and technological miracles.