Chapter II Fundamentals of Vacuum Technology
2. 1 Vacuum basics
2.2 Characterization of vacuum
2.3 Interaction between gas molecules and surfaces
Chapter 3 Vacuum Pump and Vacuum Gauge
3. 1 vacuum pump
3.2 Vacuum Measuring Instrument-Total Pressure Gauge
Chapter IV Practical Problems of Vacuum Devices
4. 1 Basic knowledge of exhaust
4.2 exudation of materials
4.3 Estimation of Exhaust Time
4.4 Practical exhaust system
4.5 Leak detection
4.6 Influence of atmospheric temperature and humidity on the device
4.7 Internal heater for baking
4.8 Emission of chemically active gases
Chapter 5 Gas Discharge and Low Temperature Plasma
5. 1 Motion of charged particles in electromagnetic field
5.2 Ionization and Excitation of Gas Atoms
5.3 gas discharge development process
5.4 Overview of Low Temperature Plasma
5.5 glow discharge
5.6 Arc discharge
5.7 High frequency discharge
5.8 Magnetron Discharge
5.9 Low Voltage and High Density Plasma Discharge
Chapter VI Film Growth and Film Structure
6. 1 overview of film growth
6.2 Adsorption, Surface Diffusion and Condensation
6.3 Nucleation and Growth of Thin Films
6.4 Formation of Continuous Film
6.5 Growth Process and Structure of Thin Films
6.6 Amorphous film
6.7 Basic characteristics of thin films
6.8 Adhesion and Internal Stress of Film
6.9 electromigration
Chapter 7 Surface Structure and Epitaxial Growth of Thin Films
7. 1 ideal surface structure
7.2 Clean surface structure
7.3 actual surface structure
7.4 Epitaxial Growth of Thin Films
7.5 Factors affecting thin film epitaxy
Chapter VIII Film Deposition.
8. 1 Brief introduction of film forming technology and film materials
8.2 Source and membrane composition-How to obtain the required membrane composition?
8.3 Adhesion Strength-How to improve the adhesion strength of the membrane?
8.4 Step Coating, Diffraction Film Rate and Hole Bottom Coating-How to deposit a thin film with uniform thickness on a large concave-convex surface?
8.5 Plasma and Its Role in Thin Film Deposition-Improvement of Thin Film Quality and Development of New Technology
8.6 Transmission Mechanism of Substrate
8.7 Film pinhole and ultra-clean workshop
Chapter 9 Vacuum Evaporation
9. 1 Overview
9.2 Evaporation of Electroplating Materials
9.3 evaporation source
9.4 Vapor emission characteristics of evaporation source and substrate configuration
9.5 Vaporization device and operation
9.6 evaporation of alloy film
9.7 Evaporation of Composite Film
9.8 pulsed laser ablation (PLA)
9.9 Molecular beam epitaxy technology
Chapter 10 ion plating and ion beam deposition
10. 1 ion plating principle
Types and characteristics of 10.2 ion plating
10.3 ion beam deposition
10.4 ion beam mixing
1 1 chapter sputtering coating
1 1. 1 ion sputtering
1 1.2 sputtering coating method
1 1.3 magnetron sputtering source
1 1.4 Examples of Sputtering Coating
Chapter 12 chemical vapor deposition
12. 1 thermal oxidation and nitridation
12.2 thermal CVD
12.3 plasma chemical vapor deposition
12.4 photomultiplier tube (photomultiplier tube)
Organometallic chemical vapor deposition (MOCVD)
12.6 metal CVD585
12.7 hemispherical grain polycrystalline Si? CVD(HSG？ CVD)
Chemical vapor deposition of 12.8 ferroelectric
Chemical vapor deposition of 12.9 low dielectric constant thin films
Chapter 13 dry etching
13. 1 dry etching and wet etching
13.2 plasma etching-excited reactive gas etching
13.3 reactive ion etching (RIE)
13.4 reactive ion beam etching (RIBE)
13.5 gas ionization cluster (GCIB) treatment technology
13.6 micromachining
Development of 13.7 dry etching ion source
14 chapter planarization technology
14. 1 the necessity of planarization technology
Overview of 14.2 planarization technology
Film growth without inhomogeneity
14.4 deposition and processing are carried out at the same time to prevent the film from growing from concave and convex.
The 14.5 thin film was planarized after growth and reprocessing.
14.6 embedding technology example
14.7 chemical mechanical polishing technology
Gas ionization cluster beam (GCIB) planarization
14.9 Mosaic wiring and planarization
14. 10 planarization technology and lithography
Chapter 15 film materials
15. 1 metal film material
15.2 inorganic and ceramic membrane materials
15.3 organic and polymer film materials
15.4 semiconductor thin film material
16 chapter application of thin film materials
Surface modification 16. 1
16.2 superhard film is used for cutting tools.
16.3 energy conversion films and devices
16.4 sensor
16.5 semiconductor device
16.6 recording and storage
16.7 flat panel display
Application of 16.8 diamond film
16.9 solar cell
16. 10 light emitting device
Chapter 17 Evaluation and characterization of thin film materials and determination of physical properties.
17. 1 Particularity of evaluation and characterization of thin film materials
Evaluation and characterization methods and selection of 17.2 thin film materials
Evaluation and characterization of 17.3 thin film materials
17.4 related technologies and devices
Examples of evaluation and characterization of 17.5 thin film materials
17.6 determination of physical properties of thin film materials
Appendix A Temperature-vapor pressure characteristics of various elements
Ionization potential of appendix B element
Appendix c table of physical constants
Appendix D (Comparison and Conversion of Common Units of Measure between Old and New)
Appendix E Energy Conversion Table, Pressure Conversion Table and Gas Property Table
Appendix F Development Forecast of Semiconductor Large Scale Integrated Circuits
Appendix G Image Resolution Level, Image Resolution (Pixels) and Aspect Ratio of Display Screen
Appendix h periodic table of elements
Appendix I Description of Common Abbreviations in Film Technology and Film Materials
refer to